The Bonded Slit Valve (BSV) Door can increase life expectancy and improve seal performance for demanding semiconductor processing applications.
Made from Chemraz, Greene Tweed’s perfluoroelastomer (FFKM) compound, or other customer-requested elastomers, the seal better withstands dynamic use for longer life and leak elimination. Seal integrity is further enhanced by a design that fills the gland and avoids traditional molded parting lines.
The bonded-gate design can provide up to a ten-fold increase in seal life during wafer production. The design also minimizes abrasion, thereby reducing particulation and contamination.
Installation requires only removing and replacing a few bolts when replacing the complete BSV Door assembly.
- Designed to eliminate movement in gland for improved seal integrity and less wear
- Durable Chemraz or other fluorocarbon withstands dynamic use to increase life expectancy of slit valve doors
- Limited particle generation for lower contamination
- Designed to fill gland for improved seal integrity and elimination of potential leaks
- Optimal compression set for improved seal integrity and life
- Seal bonded to aluminum/stainless steel door to decrease replacement downtime, simplify installation, and ensure proper seal orientation without twisting
- No traditional molded parting lines for improved seal integrity
