The EP3HTS-TC NASA Low Outgassing Silver Filled Epoxy is a one-part epoxy with thermal conductivity of 16-17 W/(m·K). It cures at temperatures of around 250 to 300°F (125 to 150°C) and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material.
EP3HTS-TC is highly electrically conductive, with a volume resistivity of less than 1x10-6 ohm-cm.
The system exhibits good dimensional stability, resists thermal cycling, and has a low coefficient of thermal expansion. It has a glass transition temperature of 136°F (58°C) and is serviceable over the temperature range of -80 to +400°F (-62 to +204°C). This compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials, and many plastics.
- For bonding, sealing, and coating
- NASA low outgassing
- Long open time at room temperature
- Cures rapidly at 250 to 300°F (125 to 150°C)
- Single component system, no mixing needed
- Not premixed and frozen, unlimited working life
- Ideal viscosity for die attach and general bonding
- Electrical and thermal conductivity
