Device Technologies Unveils New Push-Mount™ Cable Tie Assembly New product continues the DTI tradition of cost effective, streamlined solutions Marlborough, MA - February 14, 2006 - Device Technologies, Inc., an ISO9001:2000 certified company that designs and manufactures high performance specialty fastener and wire protection solutions, is pleased to announce the Push-Mount Cable Tie assembly. Device Technologies designed the tamper-proof Push-Mount Wire Tie with a low profile to prevent snagging when the cable is trimmed and the harness is pulled through a bulkhead. The remaining terminal end falls below the low profile receptacle, eliminating sharp edges common in most wire ties. The Push-Mount Wire Tie snaps quickly into a panel sheet with a maximum thickness of .135” (3.4). The result is a multi-tasking management solution that makes the Push-Mount Wire Tie a better, cleaner, faster solution from Device Technologies, Inc. About Device Technologies, Inc. Device Technologies, Inc. (DTi) has designed, manufactured, and sold specialty fasteners to a broad spectrum of industries since its founder, Hector D. Petri, Technical Director, introduced the patented Spring-Fast® High Performance Grommet Edging in 1984. This product line, and resulting extensions, has grown significantly, serving a broad spectrum of industries including Aerospace, Department of Defense, Banking/Business machines, Computer, Data storage, Gaming, HVAC, NASCAR, Semiconductor Manufacturing, and Transportation. DTi’s work in these industries has enabled the company to provide high performance, economical product solutions that include: the Fast-Drop™ Fiber Optic Radius Control Modules to maintain accurate, reliable optic signal transmission; and the Push-Lok™ Printed Circuit Board Standoff product line. DTi’s growth in the specialty fastener industry has created a new Advanced Technology Division (ATD) within the company that specializes in fully automated, linear and selective electrostatic powder coating. This innovative powder coating process is a solution applicable to cable, wire, flat wire, stampings and profile metal formed products encapsulated in a broad range of thermo-plastic and thermo-setting resins. DTi continues to invest in R & D to enhance opportunities for its product and process technologies, in compliance with ISO 9001 and AS 9100 standards. More information is available at the company’s new web site, www.devicetec.com or call (800) 669-9682. Spring Fast®, Push-Lok™, Fast-Drop™ and Push-Mount™ are registered trademarks of Device Technologies, Inc.
