SNEAK PEEK
Unfortunately, the characteristics of aluminum present a challenge for the traditional diffusion bonding process, which involves the application of radiant heat into the metal layers while in a vacuum furnace. Aluminum tends to reflect radiant heat and has a relatively low melting point in relation to the temperatures that must be achieved for proper diffusion bonding. Engineers confronted the issue by developing a conductive heating method that more rapidly reaches bonding temperature. This new approach offers an alternative to traditional diffusion bonding by circumventing the slow process of radiant heating structural assemblies in a vacuum environment.
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