MicroX ULTRA Micro Tool Grinding Machine With Nanometer Resolution

With nanometer resolution and control over the tool grinding path, the MicroX ULTRA delivers a high level of surface and edge quality through intelligent algorithms that operate collaboratively and in synchrony.

The C-axis refers to the wheel swivel axis centerline, which is aligned with the wheel's 9 o'clock grind point. This specific design is critical in the grinding of ball nose, corner radius, and profile tools. In the case of a ball nose tool, the X and Y interpolations during the grinding process will be nearly equal to the radius of the ball nose tool.

Advanced algorithms ensure precise nanometer-level control of tool grinding paths, guaranteeing superior surface and edge quality. These algorithms collaborate and synchronize to reject disturbances swiftly, enhancing axis stiffness and robustness. They actively mitigate disturbances from spindle speed variations caused by imbalanced or runout grinding wheels. Encoder subdivision error compensation automatically detects and corrects inherent encoder errors on both linear and rotary encoders.

The LaserUltra takes process stability to an even higher level by closely controlling tolerances and incorporating in-process compensation mechanisms. This advanced system adapts to factors like wheel wear, resulting in superior precision and reliability.

Seamless integration with ANCA Integrated Manufacturing System (AIMS) facilitates effortless transition to automated, lights-out production, enhancing operational efficiency and productivity.