Ideal for bonding and potting applications up to 250°F, Devcon HP 250 high-performance epoxy adhesive is resistant to heat, chemicals, and impact.
With a viscosity of 105,000 cps, HP 250 is a thixotropic paste that offers excellent gap filling and will not sag or run when used on vertical or inverted surfaces. It cures at room temperature and produces high-strength, durable, nonshrinking bonds to a wide array of substrates, including metals, glass, ceramics, plastics, composites, concrete, and wood. It has a working time of 65 minutes and a functional cure time of 24 hours. Tensile shear strength (as tested on steel) is 3,200 psi. Peel strength is 35 to 40 pli.
- Gap-filling thixotropic paste
- Heat resistant to 250°F
- Long working time (60 to 65 minutes)
- Bonds to plastics
- Open Time: 65 minutes
- Fixture Time: 300 minutes
- Gap Fill: 0.01 to 0.05 in.
- Color: Straw
- Mix Ratio: 1:1
- Working Time Min: 63
- Working Time Max: 67
- Fixture Time Min: 295
- Fixture Time Max: 305
