2023 NED Innovation Award Finalist
The FR 1.27 board-to-board connector family has a current rating per contact of 2.3 A and a pitch of 1.27 mm, allowing the connector to be used for high-power applications.
The high-speed connector enables data transmission at up to 28 Gbps. High-quality materials and contact surfaces are used. Customers are presented with new design possibilities that still comply with the established market standard. With these achievable data rates in this size of the connector, there's more flexibility in design than ever before.
The scalability of board-to-board and wire-to-board connectors with even numbers of positions ranging from 6 to 100 ensures a high degree of flexibility in component selection. As a device manufacturer, you can implement mezzanine and coplanar applications as well as mother-daughter connections. The sophisticated contact design allows for flexible alignment of the PCB.
