PHASEFLEX Microwave/RF Test Assemblies

June 14, 2017
W.L. Gore & Associates solve industry problem with easy to use test assembly

The PHASEFLEX Microwave/RF Test Assemblies, Type 0N is a lightweight assembly that provides consistent, repeatable measurements with stable electrical performance up to 50 GHz. It addresses the problem of complexity that usually accompanies high-density and modular test instruments by being the smallest, lightest, most internally ruggedized assembly on the market for modular, multiport, and multisite test applications.

 

Initial routing is much easier in cramped spaces and reduces the stress on ports and DUTs as cables are connected to test instrument ports and fixtures. This test assembly withstands continuous movement and flexing while delivering enhanced phase and amplitude stability as well.

 

The PHASEFLEX is a cost-effective package that eases calibration/troubleshooting, improves test results, speeds throughput, increases service life, offers stable electrical performance/durable mechanical protection, and reduces overall cost.

  • Torque, crush and kink resistance
  • Abrasion resistance
  • Dust and moisture resistance
  • Chemical resistance
  • Wide temperature range
  • High connector pull strength
  • Consistent, repeatable measurements with stable electrical performance up to 110 GHz
  • Longer service life with durable construction that resists crushing, twisting, and kinking
  • Enhanced phase and amplitude stability with flexure and temperature
  • Increased throughput and reduced downtime with durable and reliable performance
  • A variety of connector options specifically engineered to optimize assembly performance

Applications: 

  • Anechoic chambers
  • Antenna ranges
  • Automated test equipment
  • Bench-top testing
  • Electromagnetic compliance testing
  • High throughput RF production testing
  • Nearfield scanners
  • Portable analyzers
  • Scalar network analyzers
  • Test rack systems
  • Vector network analyzers (VNAs)
  • Wireless telecommunication module testing
  • Thermal vacuum chambers
  • High-speed digital test
  • 5G test and interconnection