In recent years, high-resolution medical imaging sensors and assembled sensor arrays have been developed to meet these industry trends. These components required new packaging technologies as semiconductor technology advanced, chip sizes grew, and devices became more compact. As a result, the designers of new sensor packaging face a host of new challenges.
These challenges place new burdens on medical imaging OEMs to specify correctly, make good material selections, and build components and assemblies with experienced processing people—all while producing systems at the highest quality and at competitive costs. The good news: technologies are on the horizon that will cut imaging sensor power consumption and heat generation, reduce size, and lower cost.
This paper explains five technical challenges that must be overcome to build a superior medical imaging sensor or assembled sensor array.
