The first-of-its-kind Ultra Temperature DDR4 DRAM module can operate from -40 to 257°F (-40 to 125°C), brings extra features to the table, opens the doors for new industrial applications, and passes multiple strict tests to prove its resilience.
The Ultra Temperature format extends the standard industrial-grade maximum temperature. The series offers 3200Mz/s high speed and is available in SODIMM and ECC SODIMM with 16GB and 32GB capacity. Value-added extras toughen DRAM and give maximum resilience such as a robust 45µ” gold finger and side fill technology that protects and strengthens delicate solder joints against thermal and mechanical stress. Anti-sulfuration is an additional protective layer on vulnerable parts, protecting them against silver alloy corrosion caused by sulfur. There is also a built-in thermal sensor that accurately measures and tracks component temperature.
With the original IC and components that meet AEC-Q200 automotive qualification, the Ultra Temperature series is verified by third-party testers who perform a whole battery of rigorous tests.
- Small outline dual in-line memory module
- Fully tested and optimized for stability and performance
- Anti-sulfuration protection against harsh environments
- Operating environment: -40 to 257°F (-40 to 125°C)
- 45?” gold finger
- RoHS compliance
- CE/FCC Certification
- Drop Test ISTA-1A (International Safe Transit Association)
- Gold finger insert & extract 100 times
- Thermal shock (MIL-STD-810G)
