A small form factor stamped contact, the Universal Contact is ideal for solderless component interconnection where miniaturization, reliability, and flexibility are required. A unique pre-loading and anti-lift design maximize contact force to ensure consistent and reliable contact integrity, while the contact's X-Y-Z movement ability provides a robust connection between the contact and component assembly.
The Universal Contact features an extended life cycle of 3,000 operations, making it suitable for a variety of applications including handset and wireless handheld devices, PC card products, home electronic devices, medical products, and automotive telematics systems.
Compliant with WEEE and RoHS directives, the Universal Contact is available in contact heights ranging from 1.3 to 4.0 mm free height. Compressed heights as low as 0.9 mm are also available. "Side wings" protect the active parts of the contact and prevent the contact from overstressing, while dome contact points provide good hertz stress and low contact resistance. The Universal Contact aids designers by allowing freedom of board positioning and providing minimized qualification time and a standard interface across applications and platforms.
- Domed contact point allows good hertz stress and low contact resistance
- "Side wings" protect the active parts of the contact which prevent contact from overstressing and the potential damage and provides the pre-load forces
- Solderwell that prevents solder wicking up the contact
- Custom, preassembled plates allow rapid manufacturing/assembly integration
- Universal Contact (UC) is compliant with WEEE and RoHS directives
