Epoxies, Etc. develops a new Potting, Encapsulating, and Casting resin. The 20-2121 is a two component, low viscosity, room temperature curing system. This is an easy to use polyurethane that will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling due to its low durometer.
Benefits:
Reduce employee exposure to dangerous chemicals
Reduce demand on non-renewable fossil fuels
Quick self leveling around components
Low stress on components & vibration resistant
Can be used in wet environments
Low Shrinkage & Exotherm
Will not damage components during cure
- Low Toxicity
- Green
- Low Viscosity
- Low Durometer
